EFFECT Photonics will be demonstrating its optical ‘System-on-Chip’ technology platform at ECOC.

 

This platform integrates all of the active and passive components of a DWDM system within a single chip. This combined with EFFECT’s novel packaging technology eliminates the need for the usual traditional ‘gold box’. Port density is increased by over 6-times and operational expenses reduced by 40% when compared with existing approaches.