Created August 2018

Stand 577

Advanced optoelectronic components and modules are experiencing record volumes driven by the rapid growth in cloud computing, data transfer and storage, and the adoption of the internet-of-things. The high power requirements, small component sizes, and elimination of materials which can outgas result in the need to attach many optoelectronic components with the eutectic die bonding process. Eutectic bonding is the process of using a solder alloy as a third material to form a continuous bond between two components. Over three decades MRSI has developed a family of high precision eutectic die bonders for high volume manufacturing of optoelectronics.