Exhibitor News

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Polycab for a Digital India

Created July 14, 2017

Stand 393

Taking forward the  Indian Prime Minister, Mr. Narendra Modi’s extraordinary initiative to connect all of the India with high speed internet, Polycab has been an active partner of the Government of India and has been working closely with them to make it a success. 



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OMPlex by Modular Photonics: Future proofing multimode fibre networks

Created July 14, 2017

Stand 105

Modular Photonics announces the release of OMPlex, a compact device connecting to the ends of multimode fibre that allows for single-channel operation. These passive devices allow for single-mode performance across legacy OM1-4 fibre extending the transmission length to several kilometres even for 10G, 40G and beyond. The technology relies on the exclusive excitation of the fundamental mode.



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Discover Keysight

Created July 14, 2017

Stand 239

Hyperscale data centers, long-distance and metro transport networks, and a more and more refined wireline and wireless access network are providing support for big data analytics and machine learning technology, which in turn provide new insights into processes and optimization in all industries. All of these systems require thorough testing before release in the market.



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Created July 14, 2017

Stand 439

World’s first fully automatic fusion splicer provides great ROI for customers and an increased productivity via reduced splice cycles.
Fujikura Europe’s 70S is still the highest quality product of its kind. As the world’s first fully automatic fusion splicer, the 70S provides great ROI for customers and an increased productivity via reduced splice cycles.



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The quickest & smallest splicer in the world from FiberFo

Created July 14, 2017

Stand 271

Exceptional splicing experience and new technology greatly reduces splicing and heating times. Advanced estimate method and core alignment technique ensure the accuracy of the splice loss calculation. Its’ small size, compact design and reliable protective casing make it suitable for any operating environment.



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Continued advancements in optical

Created July 14 2017

Stand 549

EFFECT Photonics will be demonstrating further advancements with its powerful optical ‘System-on-Chip’ platform within a compact optical transceiver module targeted at DCI and Next Generation Mobile Networks.



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New entry-level OTDR to boost operators

Created May 12, 2017

Stand 281

Yokogawa is adding an entry-level model, the AQ1000, to its range of OTDR (Optical Time-Domain Reflectometer) test instruments. The new instrument joins the existing mid-range AQ1200 series and the high-end AQ7280 series, and is specifically designed to increase the productivity of field personnel working on the installation and deployment of optical access networks such as Fibre to the Home (FTTH): the so-called “last mile” to consumers’ premises.



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Yenista Optics unveils optical component test platform

Created May 12, 2017

Stand 343

Yenista Optics has developed the CTP10, a next-generation platform for the fast testing of passive optical components such as Photonic Integrated Circuits and Wavelength Selective Switches. The CTP10 mainframe hosts up to 10 hot swappable modules and contains embedded software for configuring the desired test set-up. The GUI displays the graphs and analysis results simultaneously on two external screens.



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Teleg

Created May 12, 2017

Stand 214

For outdoors and for long runs
Telegaertner Karl Gaertner GmbH now provides fiber optic cables also per drum. In addition to the ready-to-install FO links and the cable in bulk, customers can order the universal cable A/I-DQ(ZN)BH per drum for longer cable-runs. A new addition to the product range is the external cable A-DQ(ZN)B2Y, which is also available per drum. Both cables are available with four to 48 singlemode or multimode fibers.



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Tektronix announce New Advances in Optical Measurements for 100G, 400G Standards

Created May 12, 2017

Stand 166

With 100G moving into production and 400G design efforts in full swing, the test challenges around characterization, verification and debug of both silicon and system designs have never been greater.

 

 



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